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The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages 1st Edition - 9780792384854

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About the Book :

  • Language : English
  • Binding : Hardcover
  • Contributors : Gerard Kelly

The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages 1st Edition Details :

DETAILS

  • Language : English
  • Binding : Hardcover
  • Contributors : Gerard Kelly

The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages 1st Edition Price History

  • The best price for The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages 1st Edition in India is Rs. as per November 17, 2024, 4:24 pm
  • You save NAN% by purchasing it at for over which sells it for
  • The prices for is valid in all major cities of India including Bangalore, Delhi, Hyderabad, Chennai, Mumbai, Kolkata and Pune. Please check instructions at the specific stores for any deviation.
  • All prices mentioned above are in INR

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